Date Main Contents
Jan 2, 2019 Company Establishment
Jun 17, 2019 Selected from K-Startup
Jun 26, 2019 Selected from SMTECH (Ministry of SMEs and Startups)
July 17, 2019 Establishment of Company Affiliated Research Institute
Aug 6, 2019 Venture Company Certification
May 29, 2020 Certificated as Specialized Company of Materials, Parts and Equipments

Main usage

CMP process applicable to 8 semiconductor processes

Etch : Removal of wafer surface film / Circuit Patterning
Photo : Electrical circuit printing with the two-dimensional picture on the wafer
Diffusion : Formation of insulating film on the wafer / Heating
IMP : Ion Inplantation into target
CVD : Formation of thin film on the wafer
Metal : Thin metallic film formation on the wafer
CMP : Flattening by polishing the film formed on the wafer
Cleaning : Remove unnecessary impurities or foreign substances on the wafer