ABOUT
History
| Date | Main Contents |
|---|---|
| Jan 2, 2019 | Company Establishment |
| Jun 17, 2019 | Selected from K-Startup |
| Jun 26, 2019 | Selected from SMTECH (Ministry of SMEs and Startups) |
| July 17, 2019 | Establishment of Company Affiliated Research Institute |
| Aug 6, 2019 | Venture Company Certification |
| May 29, 2020 | Certificated as Specialized Company of Materials, Parts and Equipments |
Main usage
CMP process applicable to 8 semiconductor processes
Etch : Removal of wafer surface film / Circuit Patterning
Photo : Electrical circuit printing with the two-dimensional picture on the wafer
Diffusion : Formation of insulating film on the wafer / Heating
IMP : Ion Inplantation into target
CVD : Formation of thin film on the wafer
Metal : Thin metallic film formation on the wafer
CMP : Flattening by polishing the film formed on the wafer
Cleaning : Remove unnecessary impurities or foreign substances on the wafer
Certification
